The Third Dimension: Why 3D Semiconductor Packaging is the Future of Computing
For decades, the semiconductor industry has chased a singular goal: making transistors smaller. This relentless shrinking, famously known as Moore's Law, has delivered exponential performance gains. But as we approach the physical limits of a two-dimensional world, innovation has turned on its axis. The new frontier isn't just about shrinking; it's about stacking. Welcome to the age of 3D semiconductor packaging, the revolutionary technology that is redefining how chips are built and how much power they can deliver.
The Problem with Flat Chips
In traditional (2D) packaging, chips are placed side-by-side on a printed circuit board, communicating with long electrical pathways. As devices become more complex—think AI accelerators, flagship smartphones, and high-performance computing systems—these long pathways create bottlenecks. They lead to signal delay, significant power consumption, and a large physical footprint.
3D packaging, or 3D integration, solves this…
